Job description

#WeAreIn for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks? As a Thermal Design Engineer - Lead Principal on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in? Your role Key responsibilities in your new role • Lead thermal design and development of advanced semiconductor power solutions, including IVR, VRM , and power module platforms • Architect thermal management solutions for high power-density products utilizing liquid cooling, cold plates, manifolds, heat sinks, and TIM materials • Perform detailed thermal simulations using ANSYS Icepak, FloTHERM, FEAtools, and CFD methodologies • Develop and optimize mechanical designs using SolidWorks for thermal assemblies and packaging solutions. • Conduct steady-state and transient thermal analysis to improve performance, reliability, and manufacturability. • Evaluate and select thermal interface materials (TIMs), cooling technologies, and advanced materials for semiconductor applications. • Partner cross-functionally with electrical, package, reliability, manufacturing, and systems engineering teams. • Drive prototype builds , thermal validation , and correlation between simulation and lab data. • Mentor junior engineers and provide technical leadership across thermal engineering initiatives. • Influence product roadmap decisions related to thermal performance, packaging, and system integration. Your profile Qualifications and skills to help you succeed • Bachelor’s or Master’s degree in Mechanical Engineering or relateddiscipline. PhD is a plus. • 8-10+ years of thermal/mechanical design experience within the semiconductor, power electronics, or advanced electronics cooling industry. • Expert proficiency in SolidWorks for 3D mechanical design. • Strong hands-on experience with FloTHERM, ANSYS Icepak , and FiniteElement Analysis (FEA) tools. • Deep knowledge of liquid cooling systems, including cold plates,manifolds, pumps, and coolant flow optimization. • Experience designing heat sinks, vapor chambers, TIM interfaces, and package level thermal solutions . • Strong understanding of semiconductor packaging constraints,reliability, and manufacturability. • Ability to lead programs independently and communicate effectively with executive and technical teams. Additional information Infineon Technologies is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, family care status, military or veteran status, marital status, domestic partner status, sexual orientation, or any other basis protected by local, state, or federal laws. Employment at Infineon is contingent upon proof of your legal right to work in the United States under applicable law, verification of satisfactory references, successful completion of a background check and drug test, and signing all your on-boarding documents. In some instances, if applicable, U.S. export control laws require that Infineon obtain a U.S. government export license prior to releasing technologies to certain persons. This offer is contingent upon Infineon's ability to satisfy these export control laws as related to your employment and anticipated job activities. The decision whether or not to submit and/or pursue an export license to satisfy this contingency, if applicable, shall be at Infineon's sole discretion. Infineon Technologies takes data privacy and identity theft very seriously. As such, we do not request personally-identifiable information (PII) from applicants over the internet or electronically. Please kindly refrain from disclosing your PII electronically during the application process or to unauthorized websites that may purport to be Infineon or any of our affiliates. Salary pay information: Location Indicative salary range San Jose, United States Wage range that the company expects to pay for a qualified candidate: US$ 223,440 – US$ 307,230 In addition, all employees will be eligible to participate in an incentive plan. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. #LI-EL1

Requirements

Must-haves

#WeAreIn for jobs that impact everyone's life.
What if your ideas could change the way the world connects, powers up, or thinks?
As a Thermal Design Engineer - Lead Principal on our Research & Development team, you'll
have the opportunity to merge creativity with your technical expertise by
shaping the future of technology, driving groundbreaking projects, and bringing
new ideas to life.
Your role Key responsibilities in your new role
Lead thermal design and development of advanced semiconductor power solutions, including IVR, VRM , and power module platforms
Architect thermal management solutions for high power-density products utilizing liquid cooling, cold plates, manifolds, heat sinks, and TIM materials
Perform detailed thermal simulations using ANSYS Icepak, FloTHERM, FEAtools, and CFD methodologies
Develop and optimize mechanical designs using SolidWorks for thermal assemblies and packaging solutions.
Conduct steady-state and transient thermal analysis to improve performance, reliability, and manufacturability.
Evaluate and select thermal interface materials (TIMs), cooling technologies, and advanced materials for semiconductor applications.
Partner cross-functionally with electrical, package, reliability, manufacturing, and systems engineering teams.
Drive prototype builds , thermal validation , and correlation between simulation and lab data.
Mentor junior engineers and provide technical leadership across thermal engineering initiatives.
Influence product roadmap decisions related to thermal performance, packaging, and system integration.
Your profile Qualifications and skills to help you succeed
8-10+ years of thermal/mechanical design experience within the semiconductor, power electronics, or advanced electronics cooling industry.
Expert proficiency in SolidWorks for 3D mechanical design.
Strong hands-on experience with FloTHERM, ANSYS Icepak , and FiniteElement Analysis (FEA) tools.
Deep knowledge of liquid cooling systems, including cold plates,manifolds, pumps, and coolant flow optimization.
Experience designing heat sinks, vapor chambers, TIM interfaces, and package level thermal solutions .

Nice-to-haves

Bachelor’s or Master’s degree in Mechanical Engineering or relateddiscipline. PhD is a plus.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: eightfold
Effort: medium