Job description

Job/Position Summary The Senior Process Engineer – DFR Developer & Stripper is responsible for the development, optimization, qualification, and control of dry film resist (DFR) developing and stripping processes used in glass panel semiconductor manufacturing. The role focuses on achieving robust resist pattern fidelity, residue-free stripping, defect reduction, and stable process performance for downstream metallization, plating, and advanced packaging operations. This position plays a critical role in establishing reliable lithography-related wet processing technologies for glass substrate integration and panel-level packaging manufacturing. Primary Responsibilities Develop and optimize DFR developing and stripping processes for glass substrates, panel-level packaging, and advanced semiconductor applications. Define and control critical process parameters, including developer/stripper chemistry concentration, temperature, spray pressure, conveyor speed, immersion time, and drying conditions. Own and improve DFR process performance with focus on critical dimension control, residue reduction, pattern integrity, adhesion performance, and process stability. Lead root cause analysis and corrective actions for defects, including incomplete development, resist residues, scumming, pattern collapse, undercut, delamination, staining, and surface contamination. Drive process qualification, DOE execution, and recipe optimization for new tools, resist materials, stripping chemistries, and substrate types. Work closely with lithography, wet chemistry, and analytical teams to ensure chemistry stability, contamination control, and consistent process performance. Develop and maintain SOPs, process specifications, OCAPs, process control plans, and manufacturing documentation for DFR develop and strip operations. Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, defect reduction, and process robustness. Ensure compliance with EHS and chemical safety requirements while driving continuous improvement in chemical usage, cycle time, waste reduction, and manufacturing efficiency. Own equipment process qualification activities, including SAT, installation, operational, and performance qualifications, process acceptance, and production release for DFR developer and stripper tools. Collaborate with equipment engineering teams to improve tool capability, spray uniformity, conveyor stability, filtration performance, and equipment reliability. Drive preventive maintenance optimization and equipment health monitoring in collaboration with maintenance and equipment engineering teams to improve MTBF and reduce MTTR. Requirements Engineering degree in Chemical Engineering, Materials Science, Chemistry, Metallurgy, or related field required. 8 – 12 years of experience in DFR developing, resist stripping, lithography-related wet processing, or semiconductor wet bench systems. Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently. Or if currently in India, will require relocation to Bhubaneswar, Odisha. Knowledge, Skills, and Abilities Strong understanding of dry film resist materials, developer and stripper chemistries, surface interactions, contamination control, and process compatibility. Experience with SPC, DOE, FMEA, process characterization, and analytical techniques for defect analysis and process optimization. Experience in panel-level packaging, advanced packaging, or glass substrate technologies is highly preferred. Experience in wet process equipment and familiarity with characterization tools such as optical inspection, microscopy, profilometry, adhesion testing, and defect inspection systems is preferred. Physical/Working Requirements Must be able to wear personal protective gear most of the day (where applicable). Prolonged periods of sitting or standing. Behavioral Traits Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders. A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments. The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.

Requirements

Must-haves

Job/Position Summary
This position plays a critical role in establishing reliable lithography-related wet processing technologies for glass substrate integration and panel-level packaging manufacturing.
Develop and optimize DFR developing and stripping processes for glass substrates, panel-level packaging, and advanced semiconductor applications.
Define and control critical process parameters, including developer/stripper chemistry concentration, temperature, spray pressure, conveyor speed, immersion time, and drying conditions.
Own and improve DFR process performance with focus on critical dimension control, residue reduction, pattern integrity, adhesion performance, and process stability.
Lead root cause analysis and corrective actions for defects, including incomplete development, resist residues, scumming, pattern collapse, undercut, delamination, staining, and surface contamination.
Drive process qualification, DOE execution, and recipe optimization for new tools, resist materials, stripping chemistries, and substrate types.
Work closely with lithography, wet chemistry, and analytical teams to ensure chemistry stability, contamination control, and consistent process performance.
Develop and maintain SOPs, process specifications, OCAPs, process control plans, and manufacturing documentation for DFR develop and strip operations.
Support pilot line and high-volume manufacturing ramp activities with emphasis on yield improvement, defect reduction, and process robustness.
Ensure compliance with EHS and chemical safety requirements while driving continuous improvement in chemical usage, cycle time, waste reduction, and manufacturing efficiency.
Own equipment process qualification activities, including SAT, installation, operational, and performance qualifications, process acceptance, and production release for DFR developer and stripper tools.
Collaborate with equipment engineering teams to improve tool capability, spray uniformity, conveyor stability, filtration performance, and equipment reliability.
Drive preventive maintenance optimization and equipment health monitoring in collaboration with maintenance and equipment engineering teams to improve MTBF and reduce MTTR.
Engineering degree in Chemical Engineering, Materials Science, Chemistry, Metallurgy, or related field required.
8 – 12 years of experience in DFR developing, resist stripping, lithography-related wet processing, or semiconductor wet bench systems.
Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently. Or if currently in India, will require relocation to Bhubaneswar, Odisha.
Knowledge, Skills, and Abilities
Strong understanding of dry film resist materials, developer and stripper chemistries, surface interactions, contamination control, and process compatibility.
Experience with SPC, DOE, FMEA, process characterization, and analytical techniques for defect analysis and process optimization.
Physical/Working Requirements
Must be able to wear personal protective gear most of the day (where applicable).

Nice-to-haves

Experience in panel-level packaging, advanced packaging, or glass substrate technologies is highly preferred.
Experience in wet process equipment and familiarity with characterization tools such as optical inspection, microscopy, profilometry, adhesion testing, and defect inspection systems is preferred.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: bamboohr
Effort: medium