Job description

Job/Position Summary The Electroplate Team Leader must provide technical expertise around back-end thick Cu (Bump) integration. Knowledge of photolithography, electroplating, spin-on dielectrics, as well as laminate films is a must. This individual must be able to lead teams and have excellent project management skills. Knowledge and experience of moving from R&D to high volume manufacturing in semiconductor manufacturing would put this individual above other candidates. This individual will have full visibility to the entire executive management team, with the ability to advance as the company expands and grows. Primary Responsibilities Provide technical expertise in electroplating. Lead R&D efforts to further expand current capability. Provide and lead efforts for dicing, etch, and solder ball attach. Provide support related to manufacturing continuous improvement efforts. Evaluate and improve manufacturing processes and manufacturing systems through disciplined problem-solving methodology and design of experiments. Maintain reliable and safe manufacturing systems while improving quality, yields, production rates, efficiencies, and reducing costs. Develop innovative solutions and incorporate new methods and processes to improve existing operations. Work with external companies and universities to continue R&D efforts on the latest integration improvements. Inspect materials, products, or equipment to detect defects or malfunctions in an effort to drive improvements. Determine root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods. Requirements Bachelor of Science in Engineering. 10+ years of experience in a semiconductor manufacturing environment. Must have knowledge of thick Cu (bump) manufacturing integration. People management or program leadership experience. Ability to effectively present to company executives. This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements. Knowledge, Skills, and Abilities Experience with providing technical expertise and sustaining support related to manufacturing and R&D. Must be able to lead teams and projects effectively. Knowledge of manufacturing methods and procedures. Ability to solve technical problems both independently and within a team. Knowledge of process improvement strategies around backend thick Cu processing. Physical/Working Requirements Must be able to wear personal protective gear most of the day (where applicable) Prolonged periods of sitting or standing Behavioral Traits Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders. A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments. The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives and engaging all levels of the organization. 3DGS participates in E-Verify to confirm employment eligibility. everify.gov e-verify.gov

Requirements

Must-haves

Job/Position Summary
This individual will have full visibility to the entire executive management team, with the ability to advance as the company expands and grows.
Provide technical expertise in electroplating. Lead R&D efforts to further expand current capability.
Provide and lead efforts for dicing, etch, and solder ball attach.
Provide support related to manufacturing continuous improvement efforts.
Evaluate and improve manufacturing processes and manufacturing systems through disciplined problem-solving methodology and design of experiments.
Maintain reliable and safe manufacturing systems while improving quality, yields, production rates, efficiencies, and reducing costs.
Develop innovative solutions and incorporate new methods and processes to improve existing operations.
Work with external companies and universities to continue R&D efforts on the latest integration improvements.
Inspect materials, products, or equipment to detect defects or malfunctions in an effort to drive improvements.
Determine root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods.
Bachelor of Science in Engineering.
10+ years of experience in a semiconductor manufacturing environment. Must have knowledge of thick Cu (bump) manufacturing integration.
People management or program leadership experience.
Ability to effectively present to company executives.
Knowledge, Skills, and Abilities
Experience with providing technical expertise and sustaining support related to manufacturing and R&D.
Must be able to lead teams and projects effectively.
Knowledge of manufacturing methods and procedures.
Ability to solve technical problems both independently and within a team.
Knowledge of process improvement strategies around backend thick Cu processing.
Physical/Working Requirements
Must be able to wear personal protective gear most of the day (where applicable)
Prolonged periods of sitting or standing

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Platform: bamboohr
Effort: medium