Sr. Director Analog/RF/Mixed Signal IC Design & Development

• We are seeking a highly accomplished Senior Director to lead our SiGe Analog/RF/Mixed-Signal ASIC development team.
• The ideal candidate will possess extensive experience in leading diverse technical teams, fostering innovation, and driving product development from definition through design and production in a fast-paced environment.
• Lead and mentor the Analog/RF ASIC Design Team, overseeing product definition, chip architecture, design, foundry selection/interactions, test, and productization.
• Strategically manage and scale the team to deliver cutting-edge Analog/RF ASIC solutions crucial for Nokia’s optical engine development.
• Implement and enforce robust design methodologies and processes to ensure the highest product quality and reliability.
• Drive the exploration and selection of optimal circuit topologies to achieve market-leading product performance.
• Collaborate with cross-functional teams to define comprehensive product requirements and development roadmaps.
• Lead interactions with internal and external partners on foundry processes, packaging, test, and qualification efforts.
• Oversee the complete IC/Chip product development lifecycle, including specification, design, layout, tape-out, silicon bring-up, test, and reliability.
• Partner closely with verification, CAD, product, and test engineering teams to devise and execute comprehensive DVT plans and characterization.
• Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 15 years of progressive experience in Analog/RF ASIC design and leadership.
• Proven track record of analog/RF/mixed-signal SiGe BICMOS, CMOS ICs first-pass success in design leading to productization.
• Demonstrated experience in leading and developing high-performing, diverse technical teams.
• Extensive knowledge in high-speed, high-performance, low-noise Analog/RF circuitry.
• Strong understanding of Analog/RF/mixed signal layout techniques and best practices.
• Solid understanding of 3D EM simulation tools.
• Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs.
• Strong understanding of package and board-level design optimization.
• Fluent in verbal and written communications.
• Demonstrated ability to independently resolve complex organizational and technical challenges.
• Highly self-motivated, detail-oriented, and results-driven.
• Strategic cross-functional leadership.
• Strategic thinking and business acumen related to product roadmaps and market trends.
• Strong problem-solving and decision-making capabilities.

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