Job description

Primary Duties & Responsibilities • Lead the development of next-generation integrated laser technologies for advanced optical communication and photonic systems. • Develop innovative laser integration solutions for highly integrated optical transceivers, co-packaged optics, and future optical interconnect architectures. • Design and optimize photonic components and circuits supporting laser integration, including waveguides, couplers, tapers, Bragg gratings, resonators, filters, and wavelength-selective components. • Develop architectures for integrating III-V gain materials and semiconductor laser devices with silicon photonics and other photonic platforms. • Explore and develop advanced laser integration technologies, including hybrid and heterogeneous integration approaches. • Work closely with III-V device and epitaxy teams to define laser and gain-chip requirements and optimize device performance. • Design and optimize photonic interfaces between laser chips and PICs, including mode converters, spot-size converters, and optical coupling structures. • Work with fabrication teams and foundries to define device structures, fabrication processes, and process improvements. • Develop and optimize fabrication and integration processes for laser and photonic devices. • Collaborate with advanced packaging teams to address laser-to-PIC integration, optical alignment, thermal management, electrical interfaces, and reliability. • Perform optical and electromagnetic simulations using tools such as Lumerical, Tidy3D, RSoft, Photon Design, or equivalent. • Support characterization and optimization of lasers and integrated photonic devices, including threshold current, output power, efficiency, spectrum, linewidth, wavelength tuning, and reliability. • Analyze experimental results and use measurement data to improve device designs, integration approaches, and fabrication processes. • Support PIC and laser tape-outs and work closely with foundries and fabrication partners throughout the development cycle. • Develop test structures and methodologies for evaluating photonic devices, III-V materials, and integrated laser assemblies. • Work closely with systems engineering teams to ensure laser and photonic subsystem performance meets future system requirements. • Contribute to the development of new laser architectures and photonic integration concepts. Education & Experience • PhD or Master’s degree in Electrical Engineering, Applied Physics, Photonics, Optics, Materials Science, or a related field. • Five or more years of relevant industry or advanced research experience in semiconductor lasers, integrated photonics, or optoelectronic devices. • Strong knowledge of semiconductor laser physics and laser device operation. • Strong understanding of III-V semiconductor materials and devices, including materials and structures used for lasers and optical amplifiers. • Experience with semiconductor lasers, including DFB lasers, DBR lasers, Fabry-Perot lasers, SOAs, or other integrated laser technologies. • Strong background in integrated photonic device and circuit design. • Experience designing photonic components such as waveguides, couplers, tapers, Bragg gratings, resonators, and filters. • Experience with III-V and silicon photonics integration is highly desirable. • Understanding of hybrid and heterogeneous integration approaches is highly desirable. • Experience with semiconductor fabrication processes, III-V epitaxy, wafer processing, or photonic foundries. • Experience with optical characterization of semiconductor lasers and photonic devices. • Familiarity with photonic simulation tools such as Lumerical, Tidy3D, RSoft,Photon Design, or equivalent. • Experience with PIC layout, foundry PDKs, and tapeout flows Skills • Strong understanding of photonic and optoelectronic packaging, including die attach, optical alignment, thermal management, wire bonding, and fiber coupling. • Strong interpersonal, teaming, and problem-solving skills. • Programming experience in Python or similar languages for simulation automation and data analysis is desirable. • Strong analytical and troubleshooting skills across photonics, III-V materials, fabrication, and packaging. • Excellent communication and teamwork skills. • A strong interest in developing innovative technologies for future high-bandwidth optical interconnects and highly integrated optical systems. Working Conditions • This position is hybrid • May require occasional off-site meetings or travel • Regular use of a computer and other office equipment is necessary • Interaction with team members and external contacts is a regular part of the job • May require occasional overtime and flexibility in work hours to accommodate the executive’s needs Physical Requirements • Sitting for extended periods while working on a computer or conducting meetings. • Use of hands and fingers for typing, writing, and handling documents. • Occasional lifting of objects or materials up to 20 pounds for administrative tasks. • Ability to communicate verbally and in writing. • Mobility within the office environment to attend meetings or interact with colleagues Safety Requirements All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards. Quality and Environmental Responsibilities Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System. Culture Commitment Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.: I ntegrity – Create an Environment of Trust C ollaboration – Innovate Through the Sharing of Ideas A ccountability – Own the Process and the Outcome R espect – Recognize the Value in Everyone E nthusiasm – Find a Sense of Purpose in Work Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com . Job Summary: The Principal Photonics Engineer – Laser & III-V Integration will lead development of next-generation integrated laser technologies for advanced optical communication and photonic systems. The role will focus on laser and photonic integration for high-bandwidth optical interconnects, including co-packaged optics (CPO), integrated transceivers, and emerging optical architectures. The successful candidate will have a strong background in semiconductor lasers, III-V materials and devices, integrated photonics, fabrication, and packaging. He/She will work across laser technology, photonic integrated circuits, materials, and packaging to develop scalable optical solutions. This engineer will collaborate closely with photonics, III-V device, fabrication, packaging, test, and systems teams to develop next-generation laser technologies from early concept through fabrication, characterization, and product integration.

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Must-haves

Primary Duties & Responsibilities
Lead the development of next-generation integrated laser technologies for advanced optical communication and photonic systems.
Develop innovative laser integration solutions for highly integrated optical transceivers, co-packaged optics, and future optical interconnect architectures.
Design and optimize photonic components and circuits supporting laser integration, including waveguides, couplers, tapers, Bragg gratings, resonators, filters, and wavelength-selective components.
Develop architectures for integrating III-V gain materials and semiconductor laser devices with silicon photonics and other photonic platforms.
Explore and develop advanced laser integration technologies, including hybrid and heterogeneous integration approaches.
Work closely with III-V device and epitaxy teams to define laser and gain-chip requirements and optimize device performance.
Design and optimize photonic interfaces between laser chips and PICs, including mode converters, spot-size converters, and optical coupling structures.
Work with fabrication teams and foundries to define device structures, fabrication processes, and process improvements.
Develop and optimize fabrication and integration processes for laser and photonic devices.
Collaborate with advanced packaging teams to address laser-to-PIC integration, optical alignment, thermal management, electrical interfaces, and reliability.
Perform optical and electromagnetic simulations using tools such as Lumerical, Tidy3D, RSoft, Photon Design, or equivalent.
Support characterization and optimization of lasers and integrated photonic devices, including threshold current, output power, efficiency, spectrum, linewidth, wavelength tuning, and reliability.
Analyze experimental results and use measurement data to improve device designs, integration approaches, and fabrication processes.
Support PIC and laser tape-outs and work closely with foundries and fabrication partners throughout the development cycle.
Develop test structures and methodologies for evaluating photonic devices, III-V materials, and integrated laser assemblies.
Work closely with systems engineering teams to ensure laser and photonic subsystem performance meets future system requirements.
Contribute to the development of new laser architectures and photonic integration concepts.
Education & Experience
PhD or Master’s degree in Electrical Engineering, Applied Physics, Photonics, Optics, Materials Science, or a related field.
Five or more years of relevant industry or advanced research experience in semiconductor lasers, integrated photonics, or optoelectronic devices.
Strong knowledge of semiconductor laser physics and laser device operation.
Strong understanding of III-V semiconductor materials and devices, including materials and structures used for lasers and optical amplifiers.
Experience with semiconductor lasers, including DFB lasers, DBR lasers, Fabry-Perot lasers, SOAs, or other integrated laser technologies.

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Keywords to mirror

python

Platform: oracle-cloud
Effort: medium

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Pto