Job description

Primary Duties & Responsibilities • Develop new photonic device and PIC concepts for next-generation optical interconnects and high-speed communication systems. • Design and optimize high-speed photonic components and subsystems, with applications targeting technologies such as 400G-per-lane links and co-packaged optics. • Work on the interaction between photonic devices and their electrical/RF interfaces, including high-speed modulators, photodetectors, transmission lines, electrodes, and interconnects. • Develop WDM building blocks and architectures, including wavelength filters, multiplexers/demultiplexers, resonant devices, and other wavelength-selective components. • Translate system-level requirements into practical photonic device and circuit specifications. • Evaluate design tradeoffs involving bandwidth, optical loss, power consumption, footprint, manufacturability, and scalability. • Use optical, electromagnetic, and RF simulation tools to model and optimize device performance. • Develop and tape out complex PICs using foundry PDKs and established silicon photonics design flows. • Work with foundry and fabrication teams to understand process limitations and incorporate manufacturing considerations into device designs. • Support experimental characterization and use measurement results to improve future designs. • Collaborate with electrical and packaging engineers on advanced optical-electrical integration and packaging challenges. • Contribute to the development of new design methodologies, simulation workflows, and reusable photonic building blocks. • Help identify and explore new device concepts and technologies that can enable future generations of optical interconnects. Education & Experience • PhD or Master’s degree in Electrical Engineering, Photonics, Applied Physics, Optics, or a related field. • Significant experience in integrated photonics or silicon photonics design and development. • Experience designing high-speed electro-optic devices and their associated RF structures. • Experience with electromagnetic and RF simulation tools such as HFSS, CST, ADS, or similar. • Experience with photonic simulation and design tools such as Lumerical, Tidy3D, RSoft, or equivalent. • Experience designing WDM components or wavelength-selective photonic circuits. • Experience taking PIC designs through layout and tapeout using foundry PDKs. Skills • Strong understanding of photonic device physics and PIC design. • Good understanding of RF and electromagnetic effects in high-speed photonic devices, including transmission lines, impedance matching, parasitics, and bandwidth limitations. • Familiarity with advanced optical communication architectures and the technology challenges associated with scaling data rates and integration density. • Programming experience in Python or similar languages for simulation, automation, or data analysis. • Strong problem-solving skills and the ability to work across device, circuit, and system-level challenges. Nice to have • Experience with co-packaged optics or advanced optical interconnect architectures. • Experience developing technologies targeting 400G-per-lane or other ultra-high-speed optical links. • Understanding of semiconductor fabrication processes and how process variations impact photonic device performance. • Experience working directly with photonic foundries or process development teams. • Experience with high-speed optical packaging and electrical-photonic integration. • Experience developing new technologies from early concept through prototype demonstration and product development. Working Conditions • This position is hybrid • May require occasional off-site meetings or travel • Regular use of a computer and other office equipment is necessary • Interaction with team members and external contacts is a regular part of the job • May require occasional overtime and flexibility in work hours to accommodate the executive’s needs Physical Requirements • Sitting for extended periods while working on a computer or conducting meetings. • Use of hands and fingers for typing, writing, and handling documents. • Occasional lifting of objects or materials up to 20 pounds for administrative tasks. • Ability to communicate verbally and in writing. • Mobility within the office environment to attend meetings or interact with colleagues Safety Requirements All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards. Quality and Environmental Responsibilities Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System. Culture Commitment Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.: I ntegrity – Create an Environment of Trust C ollaboration – Innovate Through the Sharing of Ideas A ccountability – Own the Process and the Outcome R espect – Recognize the Value in Everyone E nthusiasm – Find a Sense of Purpose in Work Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com . Job Summary: We are looking for an experienced Photonics Engineer to help develop the next generation of high-speed optical interconnect technologies. You will play a key role in creating advanced photonic integrated circuits and optical subsystems for applications such as 400G-per-lane communications, co-packaged optics (CPO), and future data center interconnect architectures. This role is ideal for someone with a strong foundation in integrated photonics who also understands the challenges that emerge as optical interfaces move toward increasingly higher speeds and tighter electrical-photonic integration. You will focus on development of individual photonic building blocks, with particular emphasis on high-speed electro-optic devices, RF interfaces, and wavelength-division multiplexing. You will have the opportunity to work closely with engineers across photonics, electronics, packaging, systems, and manufacturing to turn new technology concepts into working hardware.

Requirements

Must-haves

Primary Duties & Responsibilities
Develop new photonic device and PIC concepts for next-generation optical interconnects and high-speed communication systems.
Design and optimize high-speed photonic components and subsystems, with applications targeting technologies such as 400G-per-lane links and co-packaged optics.
Work on the interaction between photonic devices and their electrical/RF interfaces, including high-speed modulators, photodetectors, transmission lines, electrodes, and interconnects.
Develop WDM building blocks and architectures, including wavelength filters, multiplexers/demultiplexers, resonant devices, and other wavelength-selective components.
Translate system-level requirements into practical photonic device and circuit specifications.
Evaluate design tradeoffs involving bandwidth, optical loss, power consumption, footprint, manufacturability, and scalability.
Use optical, electromagnetic, and RF simulation tools to model and optimize device performance.
Develop and tape out complex PICs using foundry PDKs and established silicon photonics design flows.
Work with foundry and fabrication teams to understand process limitations and incorporate manufacturing considerations into device designs.
Support experimental characterization and use measurement results to improve future designs.
Collaborate with electrical and packaging engineers on advanced optical-electrical integration and packaging challenges.

Nice-to-haves

Experience with co-packaged optics or advanced optical interconnect architectures.
Experience developing technologies targeting 400G-per-lane or other ultra-high-speed optical links.
Understanding of semiconductor fabrication processes and how process variations impact photonic device performance.
Experience working directly with photonic foundries or process development teams.
Experience with high-speed optical packaging and electrical-photonic integration.
Experience developing new technologies from early concept through prototype demonstration and product development.
Working Conditions
This position is hybrid
May require occasional off-site meetings or travel
Regular use of a computer and other office equipment is necessary
Interaction with team members and external contacts is a regular part of the job
May require occasional overtime and flexibility in work hours to accommodate the executive’s needs

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Keywords to mirror

python

Platform: oracle-cloud
Effort: medium

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