Principal Engineer, Signal-Integrity and Power-Integrity
SK hynix America· enterprise· Feb 11, 2026 · 9mo agoPosted 258 days ago
San Jose, CA
In office
Full-time
Principal
$143K–$219K est.
5+ years exp
Before you apply
Ghost Signal:
Open since February 11, 2026 — 258 days, and still accepting applications.
Job description
About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite Job Title: Principal Engineer, Signal-Integrity and Power-Integrity Office Location: San Jose, CA Work Model: Onsite
About SK hynix America
At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
Job Summary:
SK hynix America is seeking a Principal Engineer to lead the Signal‑Integrity and Power‑Integrity (SIPI) strategy for next‑generation advanced packaging technologies. In this role, you will lead the design, analysis, and validation of next generation advanced packaging solutions for HBM and beyond HBM such as logic-memory integration. The position requires deep technical expertise in high-speed interface design, collaboration with global R&D teams, and contributions to industry standards for advanced packaging.
Responsibilities:
Strategic Leadership: Define and own the SIPI roadmap for advanced PKG families, aligning technical direction with product and business goals.
Architecture & Design: Lead the creation of high‑performance SiP architectures (HBM, interposer, 3 D stacks) and validate power‑delivery and signal‑integrity across the full stack—from silicon to substrate.
Methodology Development: Invent and propagate best‑practice SIPI methodologies, including electromagnetic extraction, multi‑port S‑parameter modeling, and power‑network analysis for complex packaging environments.
Technical Ownership: Oversee the end‑to‑end design flow (package definition, simulation, layout sign‑off, tape‑out) and drive continuous improvement of tools, scripts, and automation.
Mentorship & Talent Development: Coach senior and junior engineers, fostering expertise in SIPI analysis, tool usage, and design verification; champion knowledge‑sharing across global teams.
Risk Management & Sign‑off: Conduct comprehensive risk assessments, lead design reviews, and deliver final SIPI sign‑off packages that meet performance, reliability, and schedule targets.
Qualifications:
Education: Ph.D. in Electrical Engineering, or a related field (or Master’s degree with 5+ years of relevant industry experience).
Experience: ≥ 5 years of hands‑on SIPI engineering in advanced semiconductor packaging.
Technical Expertise: Deep knowledge of 2.5 D/3 D package architectures, HBM, interposer, TSV, high‑speed I/O standards, and power‑delivery networks. Proven proficiency with SIPI simulation tools (e.g., Ansys SIwave/RedHawk, Cadence Sigrity).
Design Flow Mastery: Strong background in electromagnetic extraction, multi‑port S‑parameter analysis, power‑network optimization, and tape‑out sign‑off processes for complex packages.
Leadership Skills: Demonstrated ability to influence multi‑disciplinary teams, drive technical decisions, and mentor senior engineers.
Communication: Excellent verbal and written communication skills; ability to present complex technical concepts to both engineering and executive audiences.
Preferred Qualifications:
Hands-on experience with 2.5D/3D packaging for HBM, interposers, or GPU-memory integration.
Expertise in power integrity (PI) for 3D-stacked memory systems, including PDN impedance profiling and IBIS model validation for HBM.
In‑depth familiarity with industry standards such as PCIe Gen5/Gen6, CXL, UCIe, and JEDEC memory specifications.
Familiarity with advanced packaging workflows from ball map definition to tape-out for interposer-based designs.
Proficiency in scripting/automation (Python, TCL, SKILL) to create custom analysis flows and improve productivity.
Experience validating high-speed memory interfaces using oscilloscopes, VNAs, and compliance test platforms specific to 3D packaging.
History of published technical papers, patents, or conference presentations in advanced packaging or SIPI.
Benefits:
Top Tier health insurance at no employee cost
Paid day offs: PTO + Company Holidays + Happy Fridays
Paid Parental Leave Program
401k Matching
Educational reimbursement up to $10,000 per year
Donation Matching and volunteering opportunities
Corporate discount programs
Free Breakfast/Lunch/Dinner provided to employees
Equal Employment Opportunity:
SKHYA is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information or any other status protected under federal, state, or local applicable laws. Compensation:
Our compensation reflects the cost of labor across several U.S. geographic markets, and we pay differently based on those defined markets. Pay within the provided range varies by work location and may also depend on job-related skills and experience. Your Recruiter can share more about the specific salary range for the job location during the hiring process. Pay Range $185,000 — $220,000 USD Equal Employment Opportunity:
SK hynix America is an Equal Employment Opportunity Employer. We provide equal employment opportunities to all qualified applicants and employees and prohibit discrimination and harassment of any type without regard to race, sex, pregnancy, sexual orientation, religion, age, gender identity, national origin, color, protected veteran or disability status, genetic information, or any other status protected under federal, state, or local applicable laws.
In compliance with federal law, SK hynix America also participates in the federal E-Verify program. Upon accepting an offer of employment, all newly hired individuals will be required to complete Form I-9, which includes verifying identity and legal authorization to work in the United States. Please review the official government posters detailing your rights and protections prior to applying:
E-Verify Participation Poster (Bilingual English & Spanish)
IER Right to Work Poster (English)
IER Right to Work Poster (Spanish)
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Benefits
Benefits detected in the listing.
Health Insurance
401k
Pto
Parental Leave