Mechanical Packaging Engineer Co-op at Nokia

Job description

Number of Positions: 1 Date: Jan 2027 - Apr 2027 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. • Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. • Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings. • Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements. • Drive package debug activities during product validation and qualification. • Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software. • Experience with thermal and thermo-mechanical simulations using ANSYS or similar software. • Experience with documentation of fabrication, inspection, and assembly processes. • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. It would be nice if you also had: • Knowledge of design for manufacturing of 2.5D/3D packaging. • Experience in high-speed electronics package design and/or laser package design. • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience. • Familiarity with design and simulations of optical packaging using free space optics or fiber coupling. Join our team as a Mechanical Packaging Engineer Co-op at Nokia, where you'll support the design of advanced packaging components for innovative products using 3D software. Your role involves conducting mechanical integrity and thermal simulations, performing tolerance analyses, and design test fixturing for design validation. You'll apply your knowledge of Design for Manufacturing principles while staying ahead of technological advancements. This position offers a unique chance to grow your skills in a cutting-edge environment, contributing directly to Nokia's mission to drive connectivity and shape the future of technology.

Requirements

Must-haves

Number of Positions: 1
Date: Jan 2027 - Apr 2027
Duration: 4 months
Location: Onsite in Sunnyvale, CA or New York, NY
Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.
Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings.
Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements.
Drive package debug activities during product validation and qualification.
Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software.
Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
Experience with documentation of fabrication, inspection, and assembly processes.
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
Knowledge of design for manufacturing of 2.5D/3D packaging.
Experience in high-speed electronics package design and/or laser package design.
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

Nice-to-haves

None flagged.

Application prep

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Platform: oracle-cloud
Effort: medium