Job description

About the role Own the signal-integrity and power-integrity engineering that keeps our AI accelerator running clean — across die, package, and board. You'll model and sign off the high-speed interface channels and power-delivery networks that move data and power through the system, set the SI/PI budgets the design is built to, and partner closely with the package, PCB, physical-design, and architecture teams to meet them. This is a deep-expertise, signoff-owning role at the intersection of high-speed design and power delivery: where the electrical realities of advanced-node, high-bandwidth silicon collide with aggressive performance targets, your analysis is what gives the team the confidence to tape out and build. What will you do Own signal-integrity and power-integrity analysis and signoff for DensityAI’s AI platform across silicon, package, board, and system — high-speed interface channels, power delivery, and decoupling strategy Use and develop AI assisted tool flows to accelerate SI/PI modeling, extraction, and signoff timelines What we're looking for Exceptional abilities across SI/PI analysis: link budgeting, channel modeling and S-parameter extraction, IBIS-AMI, IR-drop and power-delivery-network (PDN) analysis, and EM/thermal-aware signoff 5+ years of SI/PI experience on very high-performance designs at advanced technology nodes (7nm or better) and high-speed interfaces (PCIe, DDR/LPDDR, HBM, 112G+ SerDes, or equivalent) Hands-on with industry-standard tools (Ansys HFSS / SIwave / RedHawk, Cadence Sigrity / Clarity, Synopsys, Keysight ADS or equivalent) for extraction, EM, and PDN analysis Demonstrated ability to work closely with package, PCB, physical design, and architecture teams to set and sign off SI/PI budgets across die–package–board (Optional) 2.5D / 3D and multi-die packaging (CoWoS, EMIB, chiplets, HBM interfaces), jitter / equalization design, co-packaged optics, or post-silicon SI/PI correlation and lab validation Compensation Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO. Visa Sponsorship DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status. Export Controls Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview. Equal Opportunity DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request Full compensation packages are based on candidate experience and relevant certifications. California pay range $215,000 — $275,000 USD Compensation Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO. Visa Sponsorship DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status. Export Controls Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview. Equal Opportunity DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.

Requirements

Must-haves

What will you do
Own signal-integrity and power-integrity analysis and signoff for DensityAI’s AI platform across silicon, package, board, and system — high-speed interface channels, power delivery, and decoupling strategy
Use and develop AI assisted tool flows to accelerate SI/PI modeling, extraction, and signoff timelines
Exceptional abilities across SI/PI analysis: link budgeting, channel modeling and S-parameter extraction, IBIS-AMI, IR-drop and power-delivery-network (PDN) analysis, and EM/thermal-aware signoff
5+ years of SI/PI experience on very high-performance designs at advanced technology nodes (7nm or better) and high-speed interfaces (PCIe, DDR/LPDDR, HBM, 112G+ SerDes, or equivalent)
Hands-on with industry-standard tools (Ansys HFSS / SIwave / RedHawk, Cadence Sigrity / Clarity, Synopsys, Keysight ADS or equivalent) for extraction, EM, and PDN analysis
Demonstrated ability to work closely with package, PCB, physical design, and architecture teams to set and sign off SI/PI budgets across die–package–board
(Optional) 2.5D / 3D and multi-die packaging (CoWoS, EMIB, chiplets, HBM interfaces), jitter / equalization design, co-packaged optics, or post-silicon SI/PI correlation and lab validation

Nice-to-haves

None flagged.

Application prep

Use the role’s language and application details while tailoring your materials.

Keywords to mirror

Platform: greenhouse
Effort: quick

Benefits

Benefits detected in the listing.

Dental

Vision

401(K)

Pto