Job description

Senior Solutions Architect, Package Substrate EDA We Are Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. You Are You have spent years deep in the physical design and automation challenges of package substrate products, and you understand how to deliver solutions that work at scale. You have delivered production substrate design methodologies that integrate signal and power integrity requirements. You have built working relationships with foundry and OSAT partners. You think architecturally and can understand and resolve challenges across the data model, implementation engine, DRC engine, or manufacturing readiness. You have demonstrated leadership and direction setting for R&D teams. You can interact with a GM or a customer's most senior technologist because you understand and have solved the hard problems before. You are comfortable with ambiguity at the front end of a project but are able to drive toward clarity fast. At Synopsys, you will help shape the future of 3DIC and package substrate tooling, working with the executive R&D owner for 3DIC and influencing product strategy that affects how the industry designs the next generation of advanced packages. What You'll Be Doing • Lead R&D projects defining the architectural direction for package substrate design automation, including auto routing, power delivery network analysis, DRC engines, and database models • Drive new technical solutions beyond incremental features, working directly with the Exec Director R&D owner for 3DIC to influence product roadmap and strategic direction • Develop and optimize EDA software in C++, Python, and TCL to solve computational geometry and physical design automation challenges at scale • Collaborate with cross-functional teams on database models, collateral input/output formats like ODB++, and integration with analysis tools for design validation • Partner directly with foundries and assembly and test companies to implement emerging package substrate technologies and design methodologies, translating manufacturing constraints into tooling requirements • Provide technical mentorship and architectural guidance to engineering teams, raising the technical bar across substrate design automation projects • Communicate complex technical tradeoffs and architectural decisions to senior internal leaders and customer technologists, shaping how Synopsys and the industry approach advanced packaging challenges The Impact You Will Have • Define the technical architecture for next-generation package substrate design tools that will be used across the semiconductor industry • Enable customers to design more complex, higher-performance package substrates by solving automation bottlenecks in routing, power integrity, and design rule validation • Influence Synopsys product strategy and R&D investment decisions in the 3DIC and advanced packaging domain • Accelerate time-to-market for advanced packaging technologies by building tighter collaboration models between EDA tools and manufacturing partners • Raise the technical capability of engineering teams through mentorship and architectural leadership, creating leverage beyond your individual contributions • Shape industry standards and best practices for package substrate design methodologies through direct engagement with foundries and OSAT partners • Drive adoption of new Synopsys capabilities in package substrate design, directly affecting customer success in high-stakes production programs What You'll Need • Deep hands-on experience in package substrate design automation, including physical design, auto routing, DRC, power delivery network analysis, and design-for-manufacturing • Strong programming skills in C++, Python, and TCL, with a track record of building production-quality EDA software • Proven experience leading R&D projects that resulted in new architectural solutions, not just feature development or flow integration • Extensive knowledge of computational geometry algorithms and their application to physical design automation problems • Understanding of schematic-driven layout methodologies for package designs and the data models that connect electrical and physical domains • Experience working directly with foundries and assembly and test companies to implement new package substrate technologies and translate manufacturing requirements into design automation • Familiarity with design rule manuals, technology files, and ODB++ output formats for substrate manufacturing and design validation is a strong plus • Bachelor's or Master's degree in Computer Science, Electrical Engineering, or a related field, or equivalent practical experience Who You Are • You can walk into a technical review with a customer's chief architect or a Synopsys GM and explain a complex design automation tradeoff in two minutes without losing the nuance or the business impact • You have a point of view on what good architecture looks like, and you push back when a proposed solution will not scale or does not address the real constraint • You move between writing C++ code, reviewing algorithmic approaches, and discussing product strategy with executive leadership without losing context or momentum • You mentor engineers by asking the right questions, not by giving answers, and you know when to let someone struggle productively versus when to step in • You are comfortable with the ambiguity that comes at the start of a hard R&D problem, and you drive toward architectural clarity without waiting for perfect information • You build relationships with external partners like foundries and OSAT companies that go beyond transactional collaboration, you become a trusted technical advisor they call when they hit a wall The Team You'll Be Part Of This position reports into the Executive Director of R&D who owns the 3DIC portfolio at Synopsys, directly influencing technical and product strategy for advanced packaging solutions. Your role will involve collaboration across EDA software development teams, customer-facing application engineering, and external partners including foundries and assembly and test companies. This is a senior technical leadership role with visibility across the organization and direct impact on product direction. Rewards and Benefits We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process. #LI-MK1 At Synopsys, we want talented people of every background to feel valued and supported to do their best work. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability. In addition to the base salary, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request. The base salary range for this role is across the U.S.

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Must-haves

Senior Solutions Architect, Package Substrate EDA
What You'll Be Doing
Lead R&D projects defining the architectural direction for package substrate design automation, including auto routing, power delivery network analysis, DRC engines, and database models
Drive new technical solutions beyond incremental features, working directly with the Exec Director R&D owner for 3DIC to influence product roadmap and strategic direction
Develop and optimize EDA software in C++, Python, and TCL to solve computational geometry and physical design automation challenges at scale
Collaborate with cross-functional teams on database models, collateral input/output formats like ODB++, and integration with analysis tools for design validation
Partner directly with foundries and assembly and test companies to implement emerging package substrate technologies and design methodologies, translating manufacturing constraints into tooling requirements
Provide technical mentorship and architectural guidance to engineering teams, raising the technical bar across substrate design automation projects
Communicate complex technical tradeoffs and architectural decisions to senior internal leaders and customer technologists, shaping how Synopsys and the industry approach advanced packaging challenges
The Impact You Will Have
Define the technical architecture for next-generation package substrate design tools that will be used across the semiconductor industry
Enable customers to design more complex, higher-performance package substrates by solving automation bottlenecks in routing, power integrity, and design rule validation
Influence Synopsys product strategy and R&D investment decisions in the 3DIC and advanced packaging domain
Accelerate time-to-market for advanced packaging technologies by building tighter collaboration models between EDA tools and manufacturing partners
Raise the technical capability of engineering teams through mentorship and architectural leadership, creating leverage beyond your individual contributions
Shape industry standards and best practices for package substrate design methodologies through direct engagement with foundries and OSAT partners
Drive adoption of new Synopsys capabilities in package substrate design, directly affecting customer success in high-stakes production programs
What You'll Need
Deep hands-on experience in package substrate design automation, including physical design, auto routing, DRC, power delivery network analysis, and design-for-manufacturing
Strong programming skills in C++, Python, and TCL, with a track record of building production-quality EDA software
Proven experience leading R&D projects that resulted in new architectural solutions, not just feature development or flow integration
Extensive knowledge of computational geometry algorithms and their application to physical design automation problems
Understanding of schematic-driven layout methodologies for package designs and the data models that connect electrical and physical domains
Experience working directly with foundries and assembly and test companies to implement new package substrate technologies and translate manufacturing requirements into design automation

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