Technical Program Manager - Image Sensor & Process Integration

What the role needs

• The scope covers image sensor devices used in all modules and all systems. And, the right candidate will work across multiple locations in various continents with on-site visits with our vendors.
• 7 + years technical understanding of semiconductor devices, involving problem solving and issue root cause analysis / data analysis in a pressured environment
• MS / PhD in Electrical Engineering, semiconductor devices, or allied technical subject
• Interpersonal skills of leadership, communication, teamwork, project management, and influencing.
• Flexibility: Evening and weekends work will be required. The job also requires international travel.
• Understanding of semiconductor processes (etch, litho, etc.) wafer test, yield, wafer fab process integration, wafer packaging, back-end issues.
• Familiarity with quality systems and quality control.

From the employer

You will take the lead in driving continuous improvement activities for semiconductor device processes during product development, ramp up and throughout the product lifetime. You will work with Apple’s internal engineering team, our semiconductor device vendors and downstream with module and system integrators. The scope covers image sensor devices used in all modules and all systems. And, the right candidate will work across multiple locations in various continents with on-site visits with our vendors. 7 + years technical understanding of semiconductor devices, involving problem solving and issue root cause analysis / data analysis in a pressured environment MS / PhD in Electrical Engineering, semiconductor devices, or allied technical subject Interpersonal skills of leadership, communication, teamwork, project management, and influencing. Flexibility: Evening and weekends work will be required. The job also requires international travel. Good working knowledge of semiconductor devices and associated module components is preferred (e.g. silicon processing or III-V, etc.). Understanding of semiconductor processes (etch, litho, etc.) wafer test, yield, wafer fab process integration, wafer packaging, back-end issues. Familiarity with quality systems and quality control.