Job description

Primary Duties & Responsibilities • Manages integration of individual processes into fabrication flows for new products. • Defines new unit process requirements and targets, designs/integrates wafer fab process flows • Partners with Design, Process Engineering, Layout, Program Management and Test to scale to production and hit manufacturing yield targets. • Defines and creates test structures and layouts to fabricate and characterize new device technologies and demonstrate margin for volume manufacturing • Performs DC, small signal RF and optical testing and characterization of devices, setup test plan, collects and analyzes data • Characterizes wafer fab design rules with respect to device performance and characteristics and establish design rules for process margin and high product yield • Works with manufacturing group to specify and verify critical in-line and PCM process control metrics for high volume manufacturing • Has a good understanding of device/process interactions and process integration issues, drives improvements benefiting time to market. • Creates documentation required to transfer the process technology to manufacturing including all development data, process fingerprints, process control plan, etc • Participates in on-going continuous yield/performance improvement efforts Education & Experience • Minimum M.S. in electrical engineering or related field with 5 years of relevant job experience • Ph.D. in Electrical engineering or related field is preferred with 2 years of relevant job experience • Deep knowledge and understanding of III-V semiconductor devices and materials: physics, TCAD simulation, fab process, testing, modeling • Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes • Experience of working within cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities. Skills • Previous experience as process or integration engineer in III-V electronics or opto-electronics. • In-depth understanding of all aspects of III-V compound semiconductor processing • Familiarity with DC, small signal RF and optical testing and metrology of test structures • Strong problem solving, critical thinking, and risk management skills. • Strong communication, planning, and organizational skills. • Highly self-motivated with a strong multi-disciplinary background is essential. Working Conditions • This position is on-site full time. • Regular use of a computer and other office equipment is necessary • Interaction with team members and external contacts is a regular part of the job Physical Requirements • xxxx Safety Requirements All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards. Quality and Environmental Responsibilities Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System. Culture Commitment Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.: I ntegrity – Create an Environment of Trust C ollaboration – Innovate Through the Sharing of Ideas A ccountability – Own the Process and the Outcome R espect – Recognize the Value in Everyone E nthusiasm – Find a Sense of Purpose in Work Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com . Job Summary: Responsible for the integration of individual process steps to create robust fabrication flows for III-V semiconductor devices interacting with Device Design and Process Engineering for high volume manufacturing in the Semiconductor Devices business unit.

Requirements

Must-haves

Primary Duties & Responsibilities
Manages integration of individual processes into fabrication flows for new products.
Defines new unit process requirements and targets, designs/integrates wafer fab process flows
Partners with Design, Process Engineering, Layout, Program Management and Test to scale to production and hit manufacturing yield targets.
Defines and creates test structures and layouts to fabricate and characterize new device technologies and demonstrate margin for volume manufacturing
Performs DC, small signal RF and optical testing and characterization of devices, setup test plan, collects and analyzes data
Characterizes wafer fab design rules with respect to device performance and characteristics and establish design rules for process margin and high product yield
Works with manufacturing group to specify and verify critical in-line and PCM process control metrics for high volume manufacturing
Has a good understanding of device/process interactions and process integration issues, drives improvements benefiting time to market.
Creates documentation required to transfer the process technology to manufacturing including all development data, process fingerprints, process control plan, etc
Participates in on-going continuous yield/performance improvement efforts
Education & Experience
Minimum M.S. in electrical engineering or related field with 5 years of relevant job experience
Deep knowledge and understanding of III-V semiconductor devices and materials: physics, TCAD simulation, fab process, testing, modeling
Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes
Experience of working within cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities.
Previous experience as process or integration engineer in III-V electronics or opto-electronics.
In-depth understanding of all aspects of III-V compound semiconductor processing
Familiarity with DC, small signal RF and optical testing and metrology of test structures
Strong problem solving, critical thinking, and risk management skills.
Strong communication, planning, and organizational skills.
Highly self-motivated with a strong multi-disciplinary background is essential.
Working Conditions

Nice-to-haves

Ph.D. in Electrical engineering or related field is preferred with 2 years of relevant job experience

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Platform: oracle-cloud
Effort: medium

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