Job description

Primary Duties & Responsibilities • Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production. • Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan. • Lead PIC and EIC interconnect schematic and monitor layout design process. • Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets. • Lead optical package development to establish package manufacturability and reliability. • Collaborate with cross-functional teams consisting of laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams. Education & Experience • MS/PhD in an engineering or science discipline plus 5+ years of relevant experience • Experience with semiconductor laser design and silicon photonics. • Experience with CPO, optical transceivers or components desirable. • Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes • Experience of managing cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities. Skills & Other Requirements • Previous experience as an engineer in laser and silicon photonics R&D. • In-depth understanding of all aspects of Silicon Photonics. • Familiarity of high speed modulation in Silicon photonics including MZM, MRM, EAM at 200G and 400G. • Strong problem solving, critical thinking, and risk management skills. • Strong communication, planning, and organizational skills. • Highly self-motivated with a strong multi-disciplinary background is essential. Working Conditions • This position is on-site full time. • May require occasional off-site meetings or travel • Regular use of a computer and other office equipment is necessary • Interaction with team members and external contacts is a regular part of the job • May require occasional overtime and flexibility in work hours to accommodate the executive’s needs Physical Requirements • Sitting for extended periods while working on a computer or conducting meetings. • Use of hands and fingers for typing, writing, and handling documents. • Occasional lifting of objects or materials up to 20 pounds for administrative tasks. • Ability to communicate verbally and in writing. • Mobility within the office environment to attend meetings or interact with colleagues. Safety Requirements All employees are required to attend scheduled training, follow the site EHS procedures and Corporate EHS standards. This includes the use of proper protective equipment (PPE) as required by the job responsibilities. Managers will ensure that all safety and environmental procedures are followed consistently. They will ensure that risk assessments are performed, proper training, work instructions, required PPE is available, and will monitor compliance. Quality & Environmental Responsibilities Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System. Culture Commitment Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.: I ntegrity – Create an Environment of Trust C ollaboration – Innovate Through the Sharing of Ideas A ccountability – Own the Process and the Outcome R espect – Recognize the Value in Everyone E nthusiasm – Find a Sense of Purpose in Work Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com . Job Summary: This role will be responsible for integration of optoelectronic components for advanced Co-Packaged Optics and Optical Engine products. This will include silicon photonics chip (PIC), electrical IC (EIC), control unit, organic substrate, and integration of lasers. Candidate will need to work with internal design and process teams, as well as external suppliers to ensure the final laser integrated CPO and Light Engine product meets performance specifications and bring products from concept to production with good yield and reliability.

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Primary Duties & Responsibilities
Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production.
Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan.
Lead PIC and EIC interconnect schematic and monitor layout design process.
Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.
Lead optical package development to establish package manufacturability and reliability.
Collaborate with cross-functional teams consisting of laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams.
Education & Experience
MS/PhD in an engineering or science discipline plus 5+ years of relevant experience
Experience with semiconductor laser design and silicon photonics.
Experience with CPO, optical transceivers or components desirable.
Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes
Experience of managing cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities.
Skills & Other Requirements
Previous experience as an engineer in laser and silicon photonics R&D.
In-depth understanding of all aspects of Silicon Photonics.
Familiarity of high speed modulation in Silicon photonics including MZM, MRM, EAM at 200G and 400G.
Strong problem solving, critical thinking, and risk management skills.
Strong communication, planning, and organizational skills.
Highly self-motivated with a strong multi-disciplinary background is essential.
Working Conditions
This position is on-site full time.
May require occasional off-site meetings or travel
Regular use of a computer and other office equipment is necessary

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Platform: oracle-cloud
Effort: medium

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