Job description

Primary Duties & Responsibilities • Lead complete RF/microwave and high-speed mixed-signal hardware architecture for next-generation optical transceivers, evaluation boards, reference platforms, and production test hardware. • Design high-speed schematics and PCBAs for 100G/lane, 200G/lane, 400G/lane and beyond interconnects, supporting 800G, 1.6T, 3.2T and future architectures where applicable. • Own board-level tradeoffs for signal integrity, power integrity, EMI/EMC, grounding, return path control, isolation, thermal performance, manufacturability, serviceability, cost, reliability, and schedule. • Architect and design high-performance instrumentation used for validation, characterization, calibration, automation, manufacturing test, and sustaining support of fiber optic transceiver modules. • Select and qualify high-speed, RF, microwave, analog, precision measurement, clocking, DSP, control, sensing, connector, cable, interconnect, and power components. • Define PCB stackups, materials, copper weights, dielectric selection, via structures, backdrill strategy, impedance targets, loss budgets, fabrication rules, assembly constraints, and acceptance criteria. • Partner with SI/PI, packaging, optics, firmware, software, mechanical, thermal, reliability, manufacturing, supply chain, and operations teams to deliver complete product and test solutions. • Lead schematic capture, layout strategy, layout review, RF structure review, BOM review, DFM/DFT review, design verification, bring-up, debug, characterization, and production release. • Define digital control interfaces and hardware/firmware interaction requirements for CPLDs, FPGAs, microcontrollers, DSPs, drivers, TIAs, modulators, lasers, sensors, ADCs, DACs, and power controllers. • Develop validation plans, test methods, calibration approaches, correlation methods, guardband strategies, and production screening methods for high-volume test environments. • Perform hands-on lab measurements and debug using oscilloscopes, VNAs, spectrum analyzers, BERTs, pattern generators, optical power meters, optical spectrum analyzers, thermal chambers, power supplies, SMUs, and automated test systems. • Lead design reviews, risk reviews, failure analysis, root cause analysis, corrective actions, and lessons-learned across programs. • Mentor senior and mid-level engineers; establish hardware design best practices, checklists, libraries, reuse blocks, and review criteria. • Engage with suppliers and technical partners on advanced components, connectors, PCB materials, laminates, cable assemblies, sockets, fixtures, and precision measurement technologies. • Support critical customer discussions, roadmap evaluations, architecture tradeoffs, and executive-level technical reviews as required. Education & Experience • 15+ years of direct experience designing RF/microwave, high-speed mixed-signal, analog, digital, and precision measurement hardware. • 15+ years of hands-on schematic, PCB layout guidance, bring-up, debug, and verification experience for complex high-speed PCBAs. • 15+ years of experience designing or architecting test equipment, validation hardware, manufacturing test boards, automation fixtures, or instrumentation for high-performance electronics and/or optical communications. • Deep knowledge of high-speed PCB design for very-low-loss channels, including impedance control, crosstalk, skew, return loss, insertion loss, via transitions, connectors, cable launches, package breakout, return current, and reference plane management. • Proven understanding of RF/microwave design practices including controlled impedance transmission lines, RF launches, baluns, couplers, filters, attenuators, terminations, clock distribution, shielding, isolation, and grounding. • Expertise selecting PCB materials and stackups for high-frequency applications, including Rogers, Panasonic and equivalent low-loss laminate families, hybrid stackups, prepreg/core choices, resin systems, glass weave effects, fabrication tolerances, and cost/performance tradeoffs. • Strong command of precision analog design including low-noise sensing, voltage/current/temperature measurement, ADC/DAC interfaces, op amps, references, power monitoring, calibration, offset/gain error, noise, drift, and thermal effects. • Experience with optical module and networking ecosystems including OSFP, QSFP-DD and earlier MSA form factors; familiarity with CPO, XPO, NPO and 3.2T-class architecture challenges is strongly preferred. • Ability to evaluate high-speed ICs, drivers, TIAs, DSPs, retimers, clocking devices, power devices, sensors, controllers, and RF/microwave components across major suppliers. • Ability to create clear engineering documentation including architecture specifications, schematics, layout guidance, design review packages, validation plans, test reports, BOM rationale, risk registers, and manufacturing release documentation. • Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering or related technical discipline; advanced degree preferred. Skills • High-speed serial links, PAM4/NRZ concepts, SerDes channel design, equalization-aware hardware design, eye/jitter/noise concepts, and link budget thinking. • SI/PI simulation literacy and ability to interpret S-parameters, TDR/TDT, channel operating margin, power rail impedance, decoupling strategy, and package/connector/PCB interactions. • RF/microwave interconnect knowledge including Amphenol, Rosenberger, Samtec, Hirose, Cinch, SV Microwave, HUBER+SUHNER and equivalent connector/block ecosystems. • Working knowledge of major precision analog/RF component suppliers such as ADI, TI, Skyworks, Silicon Labs, Z-Communications and equivalent suppliers. • Working knowledge of DSP/high-speed processing ecosystems used in optical networking, including Marvell, Nvidia, Broadcom and equivalent suppliers. • Experience with EDA/CAD workflows such as Siemens/Mentor PADS, Xpedition, Cadence Allegro/OrCAD, Altium or equivalent tools; ability to guide layout engineers at expert level. • Experience with simulation and analysis tools such as CST, HFSS, ADS, HyperLynx, Sigrity, Keysight PathWave, MATLAB/Python or equivalent is preferred. • Familiarity with test automation and data analysis using Python, MATLAB, LabVIEW, C#, C/C++, SCPI, VISA or equivalent environments. • Knowledge of fiber optics test and measurement equipment including BERTs, sampling/real-time oscilloscopes, VNAs, spectrum analyzers, optical spectrum analyzers, optical power meters, wavelength meters, tunable lasers, attenuators, thermal control systems, and automated handlers. • Experience with DFM, DFA, DFT, DVT, EVT/PVT, NPI, sustaining engineering, yield improvement, supplier qualification, ECOs, failure analysis, and production release processes. • Strong technical leadership, decision making, communication, and cross-functional influence in a fast-paced engineering environment. Interview Validation Guidance • Candidate should be assessed through deep technical interview panels covering RF/MW design, high-speed board architecture, PCB material/stackup selection, SI/PI, optical transceiver standards, test equipment design, precision sensing, supplier ecosystem knowledge, and hands-on debug capability. • Interviewers should validate depth with design walkthroughs, failure-analysis examples, board bring-up case studies, instrument architecture examples, and tradeoff discussions rather than relying solely on keyword matching. • Expected level is immediate technical ownership. This is not intended as a developmental role requiring extended training before the person can lead designs. Working Conditions • Collaborative engineering environment involving office, lab, and manufacturing areas. • Job requires hands-on laboratory work with high-speed electronic, RF/microwave, optical, thermal, and automated test equipment. • On-site presence is expected for design bring-up, lab validation, production support, and cross-functional reviews; hybrid work may be possible when compatible with project needs. • Limited domestic and international travel may be required for supplier, customer, manufacturing, or cross-site engineering engagements. • Must be able to function in a fast-paced environment while managing multiple complex programs. Physical Requirements • Regular use of a computer and engineering software tools. • Hands-on lab work including probing, cabling, fixture setup, instrument configuration, and PCBA handling. • Ability to work in ESD-controlled areas and follow PPE requirements. • Occasional lifting of lab equipment, fixtures, or materials up to 20 pounds. • Ability to communicate verbally and in writing with internal and external technical stakeholders. Safety Requirements All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards. • Role requires compliance with ESD procedures including ESD garments, wrist straps, grounding, monitors, and footwear where required. • Managers will ensure safety and environmental procedures are followed consistently, risk assessments are performed, required training and work instructions are available, and compliance is monitored. Quality and Environmental Responsibilities Depending on location, this position may be responsible for the execution and maintenance of the ISO 9000, 9001, 14001 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System. Culture Commitment Ensure adherence to company’s values (ICARE) in all aspects of your position at Coherent Corp.: I ntegrity – Create an Environment of Trust C ollaboration – Innovate Through the Sharing of Ideas A ccountability – Own the Process and the Outcome R espect – Recognize the Value in Everyone E nthusiasm – Find a Sense of Purpose in Work Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. If you need assistance or an accommodation due to a disability, you may contact us at talentacquisition@coherent.com . Job Summary: Coherent is seeking a Senior Principal Electrical Engineer / Member of Technical Staff level hardware leader to own the architecture, design, validation, and production deployment of next-generation high-speed optical transceiver hardware and test instrumentation. The role is focused on RF/microwave, high-speed mixed-signal PCBAs, precision measurement subsystems, and manufacturing test platforms supporting advanced transceiver roadmaps including pluggable optics, CPO, XPO, NPO, and 3.2T-class platforms. The successful candidate must be able to operate as an immediate technical lead with minimal ramp time, translating optical module, electrical, thermal, mechanical, firmware, manufacturing, and customer requirements into robust hardware and instrumentation solutions.

Requirements

Must-haves

Primary Duties & Responsibilities
Lead complete RF/microwave and high-speed mixed-signal hardware architecture for next-generation optical transceivers, evaluation boards, reference platforms, and production test hardware.
Design high-speed schematics and PCBAs for 100G/lane, 200G/lane, 400G/lane and beyond interconnects, supporting 800G, 1.6T, 3.2T and future architectures where applicable.
Own board-level tradeoffs for signal integrity, power integrity, EMI/EMC, grounding, return path control, isolation, thermal performance, manufacturability, serviceability, cost, reliability, and schedule.
Architect and design high-performance instrumentation used for validation, characterization, calibration, automation, manufacturing test, and sustaining support of fiber optic transceiver modules.
Select and qualify high-speed, RF, microwave, analog, precision measurement, clocking, DSP, control, sensing, connector, cable, interconnect, and power components.
Define PCB stackups, materials, copper weights, dielectric selection, via structures, backdrill strategy, impedance targets, loss budgets, fabrication rules, assembly constraints, and acceptance criteria.
Partner with SI/PI, packaging, optics, firmware, software, mechanical, thermal, reliability, manufacturing, supply chain, and operations teams to deliver complete product and test solutions.
Lead schematic capture, layout strategy, layout review, RF structure review, BOM review, DFM/DFT review, design verification, bring-up, debug, characterization, and production release.
Define digital control interfaces and hardware/firmware interaction requirements for CPLDs, FPGAs, microcontrollers, DSPs, drivers, TIAs, modulators, lasers, sensors, ADCs, DACs, and power controllers.
Develop validation plans, test methods, calibration approaches, correlation methods, guardband strategies, and production screening methods for high-volume test environments.
Lead design reviews, risk reviews, failure analysis, root cause analysis, corrective actions, and lessons-learned across programs.
Mentor senior and mid-level engineers; establish hardware design best practices, checklists, libraries, reuse blocks, and review criteria.
Engage with suppliers and technical partners on advanced components, connectors, PCB materials, laminates, cable assemblies, sockets, fixtures, and precision measurement technologies.
Support critical customer discussions, roadmap evaluations, architecture tradeoffs, and executive-level technical reviews as required.
Education & Experience
15+ years of direct experience designing RF/microwave, high-speed mixed-signal, analog, digital, and precision measurement hardware.
15+ years of hands-on schematic, PCB layout guidance, bring-up, debug, and verification experience for complex high-speed PCBAs.
15+ years of experience designing or architecting test equipment, validation hardware, manufacturing test boards, automation fixtures, or instrumentation for high-performance electronics and/or optical communications.
Ability to evaluate high-speed ICs, drivers, TIAs, DSPs, retimers, clocking devices, power devices, sensors, controllers, and RF/microwave components across major suppliers.
High-speed serial links, PAM4/NRZ concepts, SerDes channel design, equalization-aware hardware design, eye/jitter/noise concepts, and link budget thinking.

Nice-to-haves

Experience with optical module and networking ecosystems including OSFP, QSFP-DD and earlier MSA form factors; familiarity with CPO, XPO, NPO and 3.2T-class architecture challenges is strongly preferred.
Master’s degree in Electrical Engineering, Electronics Engineering, Computer Engineering or related technical discipline; advanced degree preferred.
Experience with simulation and analysis tools such as CST, HFSS, ADS, HyperLynx, Sigrity, Keysight PathWave, MATLAB/Python or equivalent is preferred.

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python

Platform: oracle-cloud
Effort: medium